| 发明名称 |
SEMICONDUCTOR DEVICE ENCAPSULATON TYPE EPOVY RESIN |
| 摘要 |
The composite comprises epoxy resin, brominated epoxy resin, and phenol epoxy resin, wherein the brominated epoxy resin is 0.2 to 0.5 percent and ion activation restraint component and pH regulating component are added as an additive.
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| 申请公布号 |
KR950010108(B1) |
申请公布日期 |
1995.09.07 |
| 申请号 |
KR19920010312 |
申请日期 |
1992.06.15 |
| 申请人 |
JEIL WOOL CO., LTD. |
发明人 |
PARK, YUN - GOK;PARK, YUN - CHOL;U, HUI - U |
| 分类号 |
H01L23/18;(IPC1-7):H01L23/18 |
主分类号 |
H01L23/18 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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