Transfer sheet for making printed-wiring board by injection molding and method for producing same.

摘要

The present invention provides a transfer sheet for making a printed-wiring board by injection molding which is free from damage of circuit at injection molding and is excellent in releasability and which comprises a carrier film, a copper foil circuit and a releasing layer provided between the carrier film and the copper foil circuit. Preferably, said releasing layer provides a T-type peeling strength between the carrier film and the copper foil circuit of 0.025-0.25 kg/25 mm. A method for producing such transfer sheet is also provided which comprises coating a releasing layer on a carrier film, then contact-bonding a copper foil thereto with heating, pattern-printing an etching resist on the resulting laminate film and subjecting it to etching to form a copper foil circuit.