发明名称 BONDING CAPILLARY
摘要 PURPOSE:To obtain a bonding capillary which has high hardness, high toughness, high corrosion resistance to aqua regia, and is excellent in durability and moldability. CONSTITUTION:Electromelting alumina of 1-20wt.% is diffused in aluminum oxide or aluminum oxide in which magnesium oxide of 0.1wt.% or less is contained as solid solution, and the average grain diameter of the electromelting alumina is 1-5mum.
申请公布号 JPH07235561(A) 申请公布日期 1995.09.05
申请号 JP19940022548 申请日期 1994.02.21
申请人 SHINAGAWA REFRACT CO LTD 发明人 AYUSAWA NOBUO;SHIRONITA AKIRA;AKIZUKI TOSHIHIKO
分类号 H01L21/60 主分类号 H01L21/60
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