发明名称 |
Resin-sealed semiconductor device containing porous fluorocarbon resin |
摘要 |
A resin-sealed semiconductor device, including a chip mounting die pad, porous fluorocarbon material located just beneath the die pad, beneath a die-pad supporting layer, gold lead wires, or in a sealing resin surrounding the other components, wherein any water vapor generated by the heat of soldering will be held within the porous fluorocarbon rather than crack the sealant under internal pressure.
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申请公布号 |
US5446315(A) |
申请公布日期 |
1995.08.29 |
申请号 |
US19940182520 |
申请日期 |
1994.01.11 |
申请人 |
JAPAN GORE-TEX, INC. |
发明人 |
HAZAKI, YOSHITO;HATAKEYAMA, MINORU;FUKUTAKE, SUNAO;URAKAMI, AKIRA |
分类号 |
H01L23/29;H01L23/495;(IPC1-7):H01L23/36;H01L23/02;H01L23/12;H01L39/02 |
主分类号 |
H01L23/29 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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