| 摘要 |
PURPOSE:To improve bonding property, heat resistance and haloing resistance by forming a copper sulfide layer in an inner layer circuit, by immersing it in ammonium sulfide aqueous solution of a specified pH or higher, by roughening a surface thereof by melting a part of the copper sulfide layer and by forming an inner layer board which is treated against corrosion by silane coupling agent solution. CONSTITUTION:An electrolytic copper foil is laminated on both sides of a glass epoxy prepreg, heated, pressurized and molded to prepare a copper clad lamination board. An inner layer circuit is formed in the copper clad lamination board. After a copper sulfide layer is formed in the circuit, it is immersed in ammonium sulfide aqueous solution exceeding pH8 for melting a part of the copper sulfide layer and roughening a surface thereof. Furthermore, an inner layer board which is treated against corrosion by silane coupling agent solution is manufactured. Thereby, it is possible to improve bonding property, heat resistance and haloing resistance. |
