发明名称 MATERIAL FOR STICKING BOARD
摘要 <p>PURPOSE:To provide a material for applying a board which is useful for reusing waste materials, such as industrial wastes, causes no dew condensation by virtue of low water absorption, and has excellent heat insulating properties and adhesion and, hence, is usable as not only a heat insulating material but also a ball putty. CONSTITUTION:A material, for applying a board which is used in the application of a board 6 mainly to a wall surface 2 of a concrete wall 1, a ceiling 3, or a floor 4 of a building in such a manner that the material is interposed between the wall surface 2, the ceiling 3, or the floor 4 and the board 6. The material comprises a kneaded article composed mainly of a pulverized waste foam material comprising a styrene foam and/or a urethane foam, a coagulant comprising gypsum and/or cement, and a synthetic resin adhesive. The content of the coagulant is not more than 50 pts.vol. based on 100 pts.vol. of the waste foam material.</p>
申请公布号 JPH07224266(A) 申请公布日期 1995.08.22
申请号 JP19940033218 申请日期 1994.02.07
申请人 OKAMOTO TSUNEYOSHI 发明人 OKAMOTO TSUNEYOSHI
分类号 E04F13/21;C04B28/00;C09J1/00;C09J125/00;E04F13/08;(IPC1-7):C09J125/00 主分类号 E04F13/21
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