| 摘要 |
PURPOSE:To provide a manufacturing method of a coaxial multiwire wiring board whose interface adhesion of fluorine resin is improved. CONSTITUTION:After a metallic core line 5 is covered with fluorine resin 6 and a surface of the fluorine resin 6 is treated by metallic sodium, a coaxial wire 4 wherein a shield layer 7 is formed is fixed to a photosensitive resin layer 3 and a part of the photosensitive resin layer 3 which becomes continuity holes 8, 9 is removed by exposure and development. After a metallic plating layer 10 is formed and a shield layer 7 and a ground layer 2 of a coaxial wire are connected, the shield layer 7 of a coaxial wire of a part which becomes the continuity hole 9 is removed. A surface of the exposed fluorine resin 6 is treated again by metallic sodium. The substrate acquired in this way, an inner layer board 12 and a copper foil are laminated with an insulation resin layer 11 between, the continuity hole 9 is provided and metallic plating is applied, a metallic layer of a surface is patterned and a wiring board is obtained. |
