Method of making integrated circuit die package

摘要

A package for integrated circuit dies is disclosed comprising a ceramic base capable of having an integrated circuit die mounted to a central portion of one surface thereof to provide heat dissipation for the die; a lead frame with a central opening secured to the periphery of the same surface of the ceramic base; a raised frame member secured to both the lead frame and the peripheral portions of the same surface of the ceramic base exposed between the leads on the lead frame; a die mounted to the exposed central portion of the surface of the ceramic base surrounded by the lead frame and the raised frame member, and electrically bonded to leads on the lead frame; and a plastic potting material over and around the edges of the integrated circuit die and in contact with the exposed portion of the surface of the ceramic base adjacent the die, portions of the lead frame; and inner portions of the raised frame member to thereby encapsulate the integrated circuit die. The package is formed by first bonding a lead frame having a central opening (no die paddle) to the ceramic base. A raised frame member having a similarly shaped central opening is then bonded to the lead frame, and the ceramic base, leaving a central exposed portion of the surface of the ceramic base surrounded by the lead frame and raised frame member. The die is then bonded to this exposed surface of the ceramic base and then encapsulated with a potting resin after wire bonding of the die to the leads.