| 摘要 |
PURPOSE:To provide a semiconductor device which depends upon the external shape of a bonding capillary (pin) to be used, is restricted concerning the flat width of an inner lead and the distance between adjacent bondings, and copes with multipin, narrow pitch, and multielectrode on a semiconductor integrated circuit. CONSTITUTION:An inner lead tip part 1 is connected with an electrode 6 formed on a semiconductor integrated circuit, not by wire bonding but by using a part member for connection having an electrically continuous hole filled with conductor. |
