发明名称 |
Verfahren und Vorrichtung zum Betätigen einer elektronischen Vorrichtung. |
摘要 |
A robotically controlled pick-up tool (11) is modified by connecting to it a load cell (26) that generates a signal indicative of stress on the pick-up tool. The pick-up tool is directed toward a chip (12) to be removed and movement is stopped when the load cell generates a first signal indicative of a first level of stress. In addition to stopping movement of the pick-up tool, the first signal actuates heating of the tool to a temperature sufficient to melt the solder (13) bonding the chip to the substrate (14). The melting of the solder bonds (13) results in a reduction of stress on the tool, which causes the load cell (26) to generate a second signal indicative of the second level of stress. The second signal actuates the vacuum of the pick-up tool to cause adhesion of the chip to the pick-up tool and also initiates movement of the pick-up tool so as remove the chip from the substrate. <IMAGE> |
申请公布号 |
DE69110596(D1) |
申请公布日期 |
1995.07.27 |
申请号 |
DE1991610596 |
申请日期 |
1991.09.11 |
申请人 |
AT & T CORP., NEW YORK, N.Y., US |
发明人 |
BASAVANHALLY, NAGESH R., TRENTON, NEW JERSEY 08619, US |
分类号 |
H01L21/60;B23K1/018;H05K3/34;H05K13/04 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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