| 摘要 |
PURPOSE:To stably obtain uniform slits and through-holes free from unequal treatment by using two kids of spray nozzles installed above and below and spraying an etching liquid while oscillating these nozzles plural times back and forth and left and right in a progressing direction of substrates substrates to be treated. CONSTITUTION:While the substrates to be treated are transported by conveyor rolls 2 into an etching chamber 1, the etching liquid is sprayed to the front and rear surfaces of the substrates, by which the substrates are subjected to a surface treatment. At this time, a group A which is provided with spray pipe 3 groups having plural nozzle ports and is mounted with plural pieces thereof in a direction perpendicular to the progressing direction of the substrates and a group B which is mounted with plural pieces thereof in a direction parallel with a backward direction are arranged in a grid form on the front and rear surfaces of the conveyor rolls 2. The spray pipes 3 are so arranged that their nozzle ports do not line up in the same straight line form in the progressing direction. The nozzle ports of the group A are oscillated back and forth and the nozzle ports of the group B left and right by this constitution, by which the etching liquid is sprayed to the substrates. As a result, the uniform slits and through-holes free from the unequal treatment are obtd. |
