| 摘要 |
A charge-coupled device image sensor has a base of resin having a mount area on an upper surface with a charge-coupled device chip being connected to the mount area, leads mounted on the base and connected to the charge-coupled device chip through bonding wires, and a cover of resin joined to the upper surface of the base and having a downwardly open recess housing the charge-coupled device chip and the bonding wires. The leads include respective inner leads having respective joints connected to the bonding wires, the inner leads having portions, except the joints, embedded in the base, and respective outer leads extending from the inner leads.
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