| 摘要 |
The present invention provides a method of detecting the inclination of an IC to determine its position for arranging the sides of the IC parallel to an X-axis and Y-axis speedily and precisely without using image information of binarized images or an image of each pin. This method includes the steps of: inputting an image of an IC; defining a plurality of checking areas at predetermined positions in the image, wherein each checking area includes open ends of a plurality of IC pins; generating a density projection along a direction parallel to IC pins in each checking area; detecting the maximum value of a primary differential at the open ends of the IC pins; defining a representative point at a predetermined position on a line along the open ends; and calculating inclination of the IC according to the inclination of a reference line connecting the representative points of the checking areas.
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