| 发明名称 |
Process for attaching a lead frame to a heat sink using a glob-top encapsulation |
| 摘要 |
A method is disclosed for packaging an integrated circuit having a heat spreader for cooling an integrated circuit die and glob-topping to both protect bonding wires and attach the heat spreader to a lead frame.
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| 申请公布号 |
US5434105(A) |
申请公布日期 |
1995.07.18 |
| 申请号 |
US19940206011 |
申请日期 |
1994.03.04 |
| 申请人 |
NATIONAL SEMICONDUCTOR CORPORATION |
发明人 |
LIOU, SHIANN-MING |
| 分类号 |
H01L23/31;H01L23/433;(IPC1-7):H01L21/56;H01L21/58;H01L21/603 |
主分类号 |
H01L23/31 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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