| 摘要 |
PURPOSE:To make it possible to connect a semiconductor device pad to a lead properly with a loop wire in a trapezoidal loop. CONSTITUTION:In forming a loop wire 5 of trapezoidal loop, one end of a metal wire W is bonded to a pad 1a, then, while the metal wire W is being fed, horizontal movement opposite to a vertical rise of a capillary 10 and a lead 3 is repeated twice. Further, while the metal wire W is being fed from the capillary 10, the vertical rise to a preset height of the capillary 10 is made. Next, in the condition in which relative movement of the capillary 10 and the metal wire W is eliminated, the capillary 10 is moved horizontally to the lead side for a specified distance, then the capillary 10 is moved to the lead 3 side in a circular arc. The other end of the metal wire W is bonded onto the lead 3. |
