| 摘要 |
PURPOSE:To provide a semiconductor acceleration sensor with an improved yield. CONSTITUTION:An acceleration sensor substrate 1 is obtained by forming a surrounding fixed part 11 by machining silicon, an operation part 12 receiving force due to the acceleration at the center, and a thin flexible part 13 for connecting the fixed part 11 and the operation part 12, and by forming diffusion resistors Rx1-Rx4, Ry1-Ry4, and Rz1-Rz4 on the surface of the flexible part 13. A weight body 3 is connected to the operation part of the acceleration sensor substrate 1 and a pedestal 2 is joined to the fixed part 11 and further the pedestal 2 is joined to a bottom plate 4. A conductor film 31 is formed in advance on a surface opposing to the bottom plate 4 of the weight body 3 by metallization. |
