Verbindungsstruktur zum Verbinden von Leitern in einem elektronischen Apparat.

摘要

A connecting structure for connecting conductors used for wiring in a semiconductor device (100) comprises a first conductor (10) provided on a part of the semiconductor device for passing the flow of electrons, an insulator (12) provided on the first conductor and formed with a contact hole (13), and a second conductor (11) provided on the insulator for passing the flow of electrons, in which the second conductor is provided so as to sandwich the insulator together with a part of the first conductor. The first and second conductors are contacted to each other across the insulator at the contact hole so that the electrons flow through the contact hole. The contact hole extends in a general direction of a flow of electrons passing therethrough and has a stepped shape in which a width measured perpendicularly to the general direction of the flow of electrons increases stepwise towards the general direction of the flow of electrons.