| 摘要 |
<p>A conductive metallic pattern having at least two layers (205,215) is formed on a fired, non-conductive substrate (201) by placing a first of the layers (205) on the substrate (201), covering it with a fired, inorganic, insulating layer (209), and using a laser to form at least one opening (211) through the insulator (209) to the conductive layer (205) without piercing the conductive layer. The second conductive layer (215) is then placed on the insulating layer (209), making an electrical connection with the first conductive layer (205) through the opening (211). Also claimed is such a method in which the laser energy and insulating layer thickness are proportioned such that the laser energy is sufficient to ablate an opening through the thickness of the layer, but insufficient to penetrate the underlying conductive layer. Also claimed is a method of mfr. of a ceramic multichip module.</p> |
