发明名称 HEAT BLOCK
摘要 PURPOSE:To provide a durable heat piece, to be used for a bonding device, which is hardly damaged. CONSTITUTION:The heat block 1, to be used for a wire bonding device, is formed by a cemented carbide, and satin working is provided on the lead terminal mounting part 1a where the lead terminal 2a of a lead frame 2 is mounted. As the heat piece 1 is formed of a cemented carbide, it is hardly damaged even when a gold wire, which is bonded by mistake, is cut off. Also, the required part is satin worked and as irregular reflection is suppressed, the control system, using an optical system, of the wire bonding device does not make an erroneous operation.
申请公布号 JPH07161757(A) 申请公布日期 1995.06.23
申请号 JP19930339059 申请日期 1993.12.03
申请人 FUJI DIES KK 发明人 IKEDA TAKESHI;TOKIMURA CHIHIRO
分类号 H01L21/60;H01L21/52;(IPC1-7):H01L21/60 主分类号 H01L21/60
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