| 摘要 |
<p>PURPOSE:To improve the adhesion of a plating layer by successively electroless plating and electroplating on a base body of a thermosetting resin and after that, heat-treating at a temp near the glass transition point of the thrmosetting resin. CONSTITUTION:The base body of the thermosetting resin such as a phenolic resin is subjected to roughning processing, as aquired, successively electroless plated and electroplated with Cu or the like. The thickness of the obtained plating layer is usually <=50mum, particularly is preferably 10-40mum. Next, the base body after plated is heat-treated at the temp. of the glass transition point of the thrmosetting resin to the glass transition point plus 70 deg.C, preferably the glass transition point plus 10 deg.C to plus 60 deg.C. The heat-treating time is above a time necessary for the material to be treated to reach uniform temp. for example, 20-120min.</p> |
