| 摘要 |
PURPOSE:To obtain an epoxy resin composition excellent in moisture resistance, Al deterioration preventiveness, etc., useful for e.g. sealing agent for light- emitting elements, by incorporating a specific mixed epoxy resin with an additive such as a curing agent to effect thermosetting the resin and by bringing the pH level of the warm water extract from the thermoset resin to a specified value or lower. CONSTITUTION:This composition is obtained by incorporating (A) a mixed epoxy resin composed of at least two kinds selected from bisphenol A-type epoxy resins, bisphenol F-type epoxy resins and alicyclic epoxy resins with (B) an acid anhydride curing agent, (C) a curing promoter and (D) another additive such as an organic acid, followed by thermosetting and then bringing the pH level of the warm water extract from the thermoset resin to <=3. This composition is pref. <=20% in curing conversion rate. |
