| 摘要 |
PURPOSE:To contrive to become smaller the curvature of the mounting parts of chip parts at such a time that a film carrier substrate is wound up on a reel and so on and to prevent the chip parts from getting off from a bonding part by a method wherein slits are provided to give flexibility in a direction perpendicular to the lengthwise direction at parts for every prescribed length excluding the mounting parts of the chip parts. CONSTITUTION:A film carrier substrate 1 is provided with slits 5 for giving flexibility in a direction that intersects orthogonally the lengthwise direction for every prescribed length at the mounting part of a chip part 12. First, in case a positioning of the finger leads and the electrode pads 13 of the chip part 12 is performed on the part of a stage 7, the substrate 1 is bent at the parts of the slits 5 and as the flatness of the one block component is favorably kept, the positioning is executed easily and correctly. Even at the time of wind-up to a reel for this film carrier, the substrate is largely bent at the parts of the slits 5, the curvature of the mounting part of the chip part 12 becomes smaller, a tensile force to be applied to the finger leads 2 is remarkedly reduced and the chip part 12 is prevented from getting off from bonding part. |
