| 摘要 |
<p>PURPOSE:To prevent moisture from penetrating into a rod-like laminate through a gap between a connecting conductor and a molding resin by a method wherein the end of bonding covering resin applied onto the periphery of the rod-like laminate is interposed between the end face of the molding resin and a header. CONSTITUTION:A high-voltage semiconductor rectifier device is obtained through such a manner that diode chips each possessed of a PN junction and solders 2 are alternately laminated for the formation of a rod-like laminate 10, headers 31 larger than the diagonal line of the end face of the rod-like laminate 10 formed at the end of a connection conductor 3 are fixed to the ends of the rod-like laminate 10 sandwiching it between them, bonding covering resin 5 is applied onto the peripheral surface of the rod-like laminate 10, and furthermore the rod-like laminate 10 coated with the covering resin 5 is sealed up with molding resin 6. At this point, the end 5a of the bonding covering resin 5 is interposed between the end face 6a of the molding resin 6 and the header 31. Or, a creeping distance between the rod-like laminate fixing end 31b and a connecting conductor fixing end 3a of the header 31 is set at least 1mm long. By this setup, bonding covering resin is restrained from protruding out of the end face of molding resin.</p> |
