| 摘要 |
PURPOSE: To improve the quality of connecting part between a semiconductor circuit chip and the pin of its supporting frame by forming a pair of grooves at least at the working terminal of bonding top end and making the lengths of grooves different. CONSTITUTION: In order to improve the quality and validity of connecting part to be bonded, working is started from the assumption that a bonding zone is to be expanded. A tool 9 for bonding having a working terminal 12 formed from a pair of grooves 13 and 14 at least with different lengths is prepared. Besides, one terminal of wire 7 on a terminal connector 5 is held in the 1st groove 13 and bonded to the terminal connector 5. Further, the other terminal of wire 7 on a semiconductor chip 1 is held in the 2nd groove 14 and bonded to the semiconductor circuit chip 1. Thus, even at the time when the wire 7 is to be cut by sharp pulling so as to be ordinarily applied to a thin wire, it is bonded and no damage is applied to the joint. |
