发明名称 SEMICONDUCTOR MOLDING DEVICE
摘要 PURPOSE:To enable a transfer device, which is provided with a brush and a dust collecting mechanism to clean an upper and a lower molding die and unloads a molded product from the lower molding die, to be changed in traveling speed at cleaning corresponding to a position of contact of its brush with the molding dies. CONSTITUTION:An unloader carrier 6 is equipped with a brush 8 and a dust sucking opening 9 which sucks in resin dust at its top and a work chuck 10 at its lower part. When the unloader carrier 6 reaches over a lower molding die, the lower molding die is lowered to a pint where the brush 8 comes into contact with the upper and the lower molding die equal in contact pressure, and a molded product is held by the work chuck 10. Then, the unloader carrier 6 is withdrawn to an unloading station 5 cleaning the molding dies, and at this point, the unloader carrier 6 slows down according to a speed instruction 14 basing on unloader current position data obtained from an unloader drive motor when the brush 8 passes over a gate part to fully carry out a cleaning operation.
申请公布号 JPH07135232(A) 申请公布日期 1995.05.23
申请号 JP19930282190 申请日期 1993.11.11
申请人 TOSHIBA CORP 发明人 TAKEUCHI MASAMI
分类号 B29C45/40;B29C45/17;B29L31/34;H01L21/56;(IPC1-7):H01L21/56 主分类号 B29C45/40
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