| 摘要 |
<p>PURPOSE:To provide a chip component, in which the adhesion of an electrode layer to edges of a ceramic chip is improved by making the chip in such manner that it includes its edges having a random combination of fired areas and cut areas. CONSTITUTION:A ceramic green sheet 10 is provided both with longitudinal slits 10b, cut through from the front side to the reverse side, and with transverse grooves 10a. The green sheet is fired to form a ceramic substrate 11, which has transverse slits 11a corresponding to the slits 10a and longitudinal slits 11b corresponding to the slits 10b. A front electrode layer 13, a resistor layer 14 and a back electrode layer are formed on each unit area 12 defined by longitudinal and transverse slits. The resistor layer is trimmed to obtain a desired resistance value, and it is covered with a protective layer 15.</p> |
