SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

摘要

An apparatus for mounting a semiconductor chip to a lead frame using and adhesive mounting tape comprises:(a) a moveable tape cutter body having an upper surface thereof ; (b) substantially rectangular tape cutting means, disposed on a periphery of said upper surface of said tape cutter body, for cutting the adhesive mounting tape to obtain a cut tape portion ; and (c) a plurality of pins disposed in said tape cutter body adapted to form a plurality of through holes in said cut tape portion.