FILMTRÄGER FÜR TAB.

摘要

A tape for TAB (tape automated bonding) of a three-layered structure consisting of a protective layer, an adhesive layer and an organic insulating film used for the TAB system that is now drawing attention in the steps of fabricating semiconductor devices having an increased number of pins, a reduced size and an increased packaging density. In order to obtain reliability in insulation, chemical resistance, heat resistance and high adhesive force, an adhesive layer (2) containing at least a polyamide resin and a resol-type phenol resin and a protective layer (3) are provided on an organic insulating film (1) and the resol-type phenol resin is contained in an amount of 2 to 35 % in the adhesive layer (2).