| 发明名称 |
Circuit board |
| 摘要 |
A circuit board includes a substrate of ceramic material and conductive strips in form of a metal layer which is cast onto the surface of the substrate and formed through locally stripping metal layer from the substrate surface. The circuit board further includes a recess for receiving an inlay of metal matrix composite material. |
| 申请公布号 |
GB9506522(D0) |
申请公布日期 |
1995.05.17 |
| 申请号 |
GB19950006522 |
申请日期 |
1995.03.30 |
| 申请人 |
ELECTROVAC FABRIKATION ELEKTROTECHNISCHER SPEZIALARTIKEL GESELLSCHAFT M B H |
发明人 |
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| 分类号 |
H01L21/48;H01L23/367;H01L23/373;H05K1/03;H05K1/05;H05K3/02;H05K3/04;H05K3/10;H05K3/40;H05K3/44;H05K7/20 |
主分类号 |
H01L21/48 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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