Method for cleaning semiconductor wafers

摘要

A method for cleaning a substrate of the present invention, in which a plurality of substrates are placed substantially parallel with each other are dipped into a cleaning solution to remove particles adhering to each of the substrates, includes the step of dipping the substrates into the cleaning solution at a speed (V) through a surface of the cleaning solution, wherein the speed (V) for dipping the substrates into the cleaning solution, a minimum distance (l) among distances between the substrates, a length (L) of the substrates measured in a dip direction thereof, and a speed (v) at which the particles are transferred along the surface of the cleaning solution in a vertical direction with respect to back faces of the substrates satisfy the expression: lV>/=vL.