Transformer integrable with a semiconductor integrated circuit and method for producing thereof.

摘要

A substrate (1) including a plurality of electrically conducting vias (51) has electrical conductors (52, 53) disposed on its surfaces interconnecting pairs of the vias (51). The vias (51) and the electrical conductors (52, 53) form a first helical winding (47). Electrically insulating films (41, 42) disposed on opposite sides of the substrate (41) include further vias penetrating the insulating films and the substrate. These vias are interconnected in pairs to form a second helical winding (48) that at least partially surrounds the first winding (47) and is inductively coupled to the first helical winding (47). A relatively large mutual inductance between the two helical windings (47, 48) in a relatively small volume is achieved.