SOLDER FILM FORMING METHOD,申请号JP19930239344-传众专利搜索

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发明名称	SOLDER FILM FORMING METHOD
摘要
申请公布号	JPH0794852(A)	申请公布日期	1995.04.07
申请号	JP19930239344	申请日期	1993.09.27
申请人	NEC CORP	发明人	MAEHATA EIJI
分类号	H05K3/28;H05K3/24;(IPC1-7):H05K3/24	主分类号	H05K3/28
代理机构		代理人
主权项
地址

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