发明名称 HYBRID INTEGRATED CIRCUIT DEVICE
摘要 PURPOSE:To protect a circuit device completely against the outer air, e.g. the moisture, by sealing a supporting board mounting an LSI chip and a printed board formed with a predetermined circuit integrally with resin. CONSTITUTION:A supporting board 11 mounting an LSI chip 12 and printed boards 15, 16 mounting external devices 17, 18 are sealed with resin 14 on the upper face of the circuit device. In other words, the first and second printed boards 15, 16 and the external devices 17, 18 which are conventionally exposed to the outer air, as well as the supporting board 11 formed with the LSI chip, are sealed with the resin 14. Since the circuit device can be protected completely against the outer air, e.g. moisture, the circuit device is especially effective for a machine handling the water, e.g. a drive controller for washing machine.
申请公布号 JPH0794636(A) 申请公布日期 1995.04.07
申请号 JP19930234933 申请日期 1993.09.21
申请人 SANYO ELECTRIC CO LTD 发明人 IIMURA JUNICHI;MAEHARA EIJU;SHIMIZU HISASHI
分类号 H01L23/28;H05K1/14 主分类号 H01L23/28
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