| 摘要 |
<p>PURPOSE:To provide a film deposition system in which the distribution of film thickness is enhanced while preventing abnormal discharge by enhancing both the mounting/demounting performance of wafer onto/from a holder and the close adhesion simultaneously. CONSTITUTION:1). A wafer holder 1 for holding a wafer to which power is applied is made of a hollow conductor provided with a suction hole 5 along the periphery of the wafer and a suction port 4 for evacuating the hollow section. 2). The wafer holder 1 is held vertically in a film deposition system and a pin 3 having a cut holds the wafer when the hollow section is not evacuated with the cut being set wider than the thickness of the wafer. 3). A plurality of wafer holders 1 are arranged side by side at an interval and every other holder is connected with a first conductor through the suction port 4 and the remaining holders are connected with a second conductor through the suction port. Power is then applied between both conductors thus evacuating the hollow section through both conductors.</p> |
