| 摘要 |
<p>Provided is a process for removing organic materials from semiconductor wafers and a process for chemical solvent drying of wafers. In the drying process, a wafer (14) submerged in a bath having a lower aqueous layer (152) and an upper organic layer (154) is lifted from the lower aqueous layer up through the upper organic layer and removed from the bath. An apparatus for completing this process is also disclosed.</p> |
