发明名称 |
A bonding tool. |
摘要 |
<p>A bonding tool for TAB, used in the production of semiconductor chips, which is provided with, at the end thereof, a substrate (3) consisting of a member selected from the group consisting of sintered compacts of Si or Si3N4 as a predominant component, sintered compacts of SiC as a predominant component, sintered compacts of AlN as a predominant component and composite compacts thereof, the substrate being coated with polycrystalline diamond (7) deposited by gaseous phase synthesis method.</p> |
申请公布号 |
EP0435423(B1) |
申请公布日期 |
1995.03.29 |
申请号 |
EP19900309271 |
申请日期 |
1990.08.23 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD. |
发明人 |
NAKAMURA, TSUTOMU;TANAKA, KATSUYUKI;NAKAI, TETSUO;IMAI, TAKAHIRO;IKEGAYA, AKIHIKO;FUJIMORI, NAOJI |
分类号 |
C04B41/50;C04B41/85;(IPC1-7):C04B41/87;C04B37/02;B23K3/04 |
主分类号 |
C04B41/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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