PACKAGING OF SILICON OPTICAL COMPONENTS

摘要

This invention is a new optical packaging and interconnection technology which is particularly effective in not only addressing the problem ofattaching fiber pigtails to glass waveguide silicon devices, but also in isolating these waveguide devices from the deleterious effects of their external environment. Animportant aspect of the invention lies in the novel realization that the foregoing objectives may be achieved by covering the device with a thin silica coverplate affixed with a low index epoxy, which act as an extended cladding layer for optically confining the optical radiation below the coverplate.