Resin composition for laser marking.

摘要

A thermoplastic resin composition, in which B) 0.1-30 parts by weight of microcapsules composed of an enveloping layer made up of a composition that undergoes thermosensitive decomposition at a temperature of 200-1,000 DEG C and a core component with heat resistance higher than that of said composition of the enveloping layer is added with A) 100 parts by weight of thermoplastic resin. The surface of a molded product of the thermoplastic resin composition can be subjected to vivid and durable laser marking simply and in a short period of time.