| 摘要 |
PURPOSE:To detect the cause of a change in conditions in advance, to prevent a crack from being produced, to eliminate the wasteful adjusting processes and to increase an operating rate in a wire bonding apparatus by which a semiconductor chip and a lead for a case are connected by a thin metal wire. CONSTITUTION:An impulsive-wave output park 12 which detects a shock caused when an impulse sensor 5 is knocked by a bonding tool 2 and which outputs impulsive waves and a comparison and detection part 13 which stores reference impulsive waves in advance, which compares the impulsive waves output from the impulsive-wave output part with the reference impulsive waves, which outputs a difference in their waveforms and which issues an alarm due to the difference or corrects the condition of a bonding load or of ultrasonic waves are installed. Then, when there is a difference between the waveform of the impulsive waves output by the impulsive-wave output part by a firsts knock and the waveform of the reference impulsive waves, the knock energy of the bonding tool is changed. When there exists a difference between the waveform of the impulsive waves obtained by a next knock to the impulse sensor and the waveform of the reference impulsive waves, an alarm is generated, and the mechanical slack and the wear of a bonding arm, the bonding tool and the like are notified. |
