发明名称 FORMATION OF LEAD BENDING
摘要 PURPOSE:To provide a lead bending method by which leads can be bent without rubbing the mounting surfaces of the leads on a substrate. CONSTITUTION:In a pre-bending process, the front ends of leads 2 are formed in circular arc shapes. In a first bending process, the leads 2 are bent so that the center positions of the circular arcs can move toward a package 1 from the pre-bent positions while the leads 2 are returned to almost horizontal positions. In a second bending process, the leads 2 are bent downward to 45 deg. positions while the side faces of the leads 2 are pressed. In a third process, the leads 2 are turned to the package 1 side and bent to almost 90 deg. positions while the side faces of the leads 2 are pressed. In a fourth process, in addition, the leads 2 are bent until the front end sections of the leads 2 reach the rear surface of the package 1 while both edge sections of the circular arcs are pressed.
申请公布号 JPH0766344(A) 申请公布日期 1995.03.10
申请号 JP19930210621 申请日期 1993.08.25
申请人 OKI ELECTRIC IND CO LTD 发明人 SUGIMOTO SEIICHI
分类号 H01L23/50;H05K13/04 主分类号 H01L23/50
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