| 摘要 |
PURPOSE:To remove easily an unnecessary prepreg hardened material and the rigid circuit board part of the title printed board by a method wherein the printed board has prepregs and a non-adhesive surface and after laminated boards, which respectively have a rigid internal layer circuit, laminated boards for insulation and metal foils are laminated and molded, unnecessary metal foils and laminated boards of the metal foils and the laminated boards are removed from the non-adhesive surface. CONSTITUTION:Prepregs 2, which are used as covering layers, are respectively superposed on the surface and rear of a flexible intermediate layer circuit sheet 1 and laminated boards 3, which are respectively formed with a non-adhesive film at a prescribed position thereon, are respectively superposed on the upper and lower covering layers. Moreover, rigid circuit boards 5, which are respectively formed with a circuit on one surface thereof and are respectively bonded with a copper foil on the whole other one surface thereof, are respectively superposed via prepregs 4 for interlayer bonding and the prepregs 2, the boards 3, the prepregs 4 and the boards 5 are respectively laminated on the surface and rear of the sheet 1 and are molded. Then, surface-rear through holes and an external layer circuit are formed in and on an integrally formed copper-clad multilayer laminated board and a multilayer printed board is formed. When, after an electronic component is mounted on the multilayer printed board, V-shaped notches are respectively cut in breaking surfaces and a hardened resin layer on a flexible circuit sheet part to be exposed, unnecessary metal foils and the like are torn off from the surface of the non-adhesive film to remove. |
