发明名称 MULTI-LAYER CIRCUIT SUBSTRATE WITH BUILT-IN CAPACITOR
摘要 <p>PURPOSE:To provide a multi-layer circuit substrate with built-in capacitor having an excellent substrate strength by reducing an absolute value of a dielectric constant temperature characteristic of a substrate body. CONSTITUTION:In a multi-layer circuit substrate with built-in capacitor 10, a plurality of dielectrics 1a, 1b... composed of a glass component and an inorganic filler are laminated in which a specific wiring pattern 2 and a capacitance generation pattern 3 composed of conductive materials of a gold, silver, or copper system is formed, and on which a thick film resistor film 6 is formed. The inorganic filler has a perovskite crystalline structure of alumina and a particle size 2 to 10mum and contains a dielectric material having a negative temperature characteristic.</p>
申请公布号 JPH0766563(A) 申请公布日期 1995.03.10
申请号 JP19930216533 申请日期 1993.08.31
申请人 KYOCERA CORP 发明人 IMOTO AKIRA;YASUI MASAKAZU;FURUHASHI KAZUMASA
分类号 H01G4/40;H05K1/00;H05K1/03;H05K1/16;H05K3/46;(IPC1-7):H05K3/46 主分类号 H01G4/40
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