发明名称 A method of achieving selective inhibition and control of adhesion in thick-film conductors.
摘要 <p>A printed circuit board assembly (10) comprising a support member (40) having an insulative top surface (42); a plurality of firmly adherent conductors (50) firmly secured to the top surface of the support member; at least one electrical module (20) having external contacts (30); and a plurality of controllably adherent conductors (60) each having a first end (60b) in electrical contact with a corresponding firmly adherent conductor and a second end (60a) in electrical contact with a corresponding external contact on the electrical module, the intermediate portion of each controllably adherent conductor between its first and second ends being movable to relieve stresses.</p>
申请公布号 EP0355965(B1) 申请公布日期 1995.02.15
申请号 EP19890306821 申请日期 1989.07.05
申请人 DELCO ELECTRONICS CORPORATION (A DELAWARE CORP.) 发明人 HEARN, JOHN ALLEN;SCHWARZ, DWIGHT LANCE;SARMA, DWADASI HARE RAMA;PALANISAMY, PONNUSAMY
分类号 H05K1/18;H01L21/48;H01L21/60;H01L23/498;H01L23/538;H05K1/03;H05K1/09;H05K3/12;H05K3/40;(IPC1-7):H05K3/40 主分类号 H05K1/18
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