发明名称 |
A method of achieving selective inhibition and control of adhesion in thick-film conductors. |
摘要 |
<p>A printed circuit board assembly (10) comprising a support member (40) having an insulative top surface (42); a plurality of firmly adherent conductors (50) firmly secured to the top surface of the support member; at least one electrical module (20) having external contacts (30); and a plurality of controllably adherent conductors (60) each having a first end (60b) in electrical contact with a corresponding firmly adherent conductor and a second end (60a) in electrical contact with a corresponding external contact on the electrical module, the intermediate portion of each controllably adherent conductor between its first and second ends being movable to relieve stresses.</p> |
申请公布号 |
EP0355965(B1) |
申请公布日期 |
1995.02.15 |
申请号 |
EP19890306821 |
申请日期 |
1989.07.05 |
申请人 |
DELCO ELECTRONICS CORPORATION (A DELAWARE CORP.) |
发明人 |
HEARN, JOHN ALLEN;SCHWARZ, DWIGHT LANCE;SARMA, DWADASI HARE RAMA;PALANISAMY, PONNUSAMY |
分类号 |
H05K1/18;H01L21/48;H01L21/60;H01L23/498;H01L23/538;H05K1/03;H05K1/09;H05K3/12;H05K3/40;(IPC1-7):H05K3/40 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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