| 摘要 |
A cooling structure for integrated circuits including a plurality of integrated circuits, and a wiring substrate for mounting these integrated circuits and forming connections to a power source and signals. A plurality of cylindrical pistons are provided, with each having an open upper portion, a pair of protruding portions on an outside surface of the open upper portion and a spherical lower surface. A housing is provided which has holes in positions corresponding to positions of the respective integrated circuits on the wiring substrate, each hole having an O-ring groove formed in an inner wall thereof for receiving an O-ring and receiving the piston therein. The cooling structure further includes a first cover covering the pistons and the housing and having nozzles for jetting liquid coolant vertically to bottom surfaces of the respective pistons and coolant outlet ports for circulating the liquid coolant which has cooled the interiors of the pistons, and a second cover having coolant passages in the form of grooves for circulating the liquid coolant.
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