| 摘要 |
PURPOSE:To securely remove defectives securely by dripping or applying a light shielding material on only a circuit pattern which is defective or has dust stuck, and then performing photolithography and cleaning a glass mask. CONSTITUTION:The light shield material 22 is dripped on only the defective or dust-stuck circuit pattern 21 and caked to thickness with which disables electric operation in probe inspection. Then, the glass mask whose pattern defect rate is lower than a specific standard value is used for the photolithographic process and cleaned to remove the light shielding material 22 from the glass mask. The circuit pattern where the light shielding material is dripped indicates that the product can be not be forwarded and is selected afterward with a probe, so that the abnormal generation of heat or the breaking of a wire is prevented during use. |
