| 摘要 |
<p>PURPOSE:To form an inner lead for internal wiring which does not need the margin of lamination of an LOC structure of tape and stands isolated on the tape at the same time with an inner lead for external lead out. CONSTITUTION:An inner lead 11 is external lead out, and the end of which is fixed with an insulating tape 2, and the other end of which is led out of the insulating tape 2. Moreover, an inner lead 12 is for internal lead out, and it is fixed, being individually isolated on the insulating tape 2. The insulating tape 2 where both inner leads are united is fixed to the surface of a semiconductor chip 3, and the inner leads 11 and 12 and each electrode pad 4 on the semiconductor chip 3 are connected with each other by bonding wires 5. In this invention, the insulating tape is stuck to the lead frame before completion of processing, and then the inner lead and the insulating tape are struck integrally.</p> |
