发明名称 |
DRAHTVERBINDUNGEN UND ELEKTRISCHE KONTAKTE EINER INTEGRIERTEN SCHALTUNGSANORDNUNG. |
摘要 |
An integrated circuit devicer package includes a rigid frame and flexible tape assembly having wire leads between the die attach pad, conductive lead fingers, and the I.C. chip. A dam structure prevents resin flow to ensure proper wire bonding and a wedge prevents electrical shorting. A recognition pattern enables precise wire bonding. A epoxy molding compound is interposed in cavities formed in a Kapton layer to preclude delamination. |
申请公布号 |
DE3851741(T2) |
申请公布日期 |
1995.02.02 |
申请号 |
DE19883851741T |
申请日期 |
1988.01.26 |
申请人 |
LSI LOGIC CORP., SANTA CLARA, CALIF., US |
发明人 |
LONG, JON, LIVERMORE, CA 94550, US |
分类号 |
H01L21/52;H01L21/60;H01L23/31;H01L23/495;H01L23/498;H01Q21/06;H01Q21/24 |
主分类号 |
H01L21/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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