发明名称 Katalyseringsförfarande i samband med icke-elektrisk plätering
摘要 <p>There is disclosed a novel process for catalyzation for trapping of a catalyst metal involved with the adhesion of an electroless plating to a substrate. The process is carried out by employing neither the sensitizing-activating method nor the catalyst-accelerator method. Specifically, in forming an electroless plating on the surface of a non-conductive substance as a substrate, the surface of the non-conductive substance is coated with a treatment liquid containing at least chitosan or a chitosan derivative before the steps of catalyzation and electroless plating to form a hydrophilic coating film on the surface of the non-conductive substance.</p>
申请公布号 FI950446(A0) 申请公布日期 1995.02.01
申请号 FI19950000446 申请日期 1995.02.01
申请人 DAISHIN CHEMICAL CO. LTD;OMURA TORYO CO. LTD 发明人 OMURA, YOSHIKO
分类号 C23C18/28;C23C18/20;C23C18/22;C23C18/30;F02B75/02;H05K3/18;H05K3/38;(IPC1-7):C23C 主分类号 C23C18/28
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