| 摘要 |
PURPOSE:To reduce size and weight and improve installation and workability. CONSTITUTION:A fixed platen 51 and a movable platen 52 are installed, a fixed side chase unit 56 is so arranged that at least a portion is accommodated in a recessed part 53 formed in the fixed platen 51, and a movable side chase unit 59 is so arranged that at least a portion is accommodated in a recessed part 54 formed in the movable platen 52. The movable side chase unit 59 forms a cavity between the movable side chase unit 59 and the fixed side chase unit 56. A pot 30 is formed in the movable side chase unit 59, and a plunger 35 is arranged in the pot 30 so as to be able to freely slide. In this case, a fixed side base unit and a movable side base unit are not arranged, so that a semiconductor sealing apparatus can be made small and light in weight. |
