| 摘要 |
PURPOSE:To simplify the steps, to shorten a line time and to reduce the cost of a light emitting diode by sealing the diode by an insert injection molding method with specific poly 4-methyl-1-pentene. CONSTITUTION:A lead frame to which a semiconductor chip is bonded is inserted into a metal mold by an insert injection molding method by poly 4- methyl-1-pentene having 50g/10min or more of melt flow rate under a load of 5kg at 260 deg.C, and the periphery of the chip is sealed. Accordingly, its productivity is excellent as compared with a dipping, hardening method, and a sealing die required for the dipping method can be eliminated. Further, the poly 4- methyl-1-pentene has good electric insulation, good waterproofness, wet resistance, further excellent medicine resistance, excellent heat resistance and transparency. Accordingly, even if it is used at high temperature under high moisture, the performance of a light emitting diode can be sufficiently performed. |
